Latest Product Updates and Feature Enhancements on Tito
TI brings intelligence to battery management systems with industry's highest-cell-count EIS-enabled battery monitor
Texas Instruments (TI) has introduced the BQ79826Z-Q1, a battery monitor with integrated electrochemical impedance spectroscopy (EIS) technology. This product supports up to 26 cells per device, enha...ncing safety and performance in electric vehicles and energy storage systems by providing real-time diagnostics and reducing system complexity. The monitor is designed to improve battery life and safety by detecting potential failures within battery cells.
Texas Instruments (TI) has launched two new microcontroller families, MSPM0G5187 and AM13Ex, featuring the TinyEngine neural processing unit (NPU) to enhance edge AI capabilities. These MCUs aim to i...mprove AI inference efficiency in low-power applications, such as wearables and home appliances, by reducing latency and energy consumption. The new products are part of TI's strategy to integrate AI acceleration across its microcontroller portfolio, offering significant performance improvements for both consumer and industrial devices.
Texas Instruments (TI) has integrated a Neural Processing Unit (NPU) into its AM13E230x microcontroller family, enhancing AI capabilities for edge applications. This upgrade aims to improve processin...g efficiency and performance in various industrial and consumer electronics applications.
TI expands microcontroller portfolio and software ecosystem to enable ...
Texas Instruments (TI) has launched two new microcontroller families, MSPM0G5187 and AM13Ex, featuring the TinyEngine NPU for enhanced edge AI capabilities. These MCUs offer up to 90 times lower late...ncy and over 120 times lower energy use per AI inference. They integrate with TI's CCStudio IDE, enabling efficient AI deployment in various applications, including motor control and consumer electronics.
Lattice Semiconductor collaborates with TI to advance Edge AI
Lattice Semiconductor and Texas Instruments (TI) have partnered to enhance edge AI systems by integrating TI's sensing technologies with Lattice's Holoscan Sensor Bridge solution. This collaboration ...aims to simplify sensor integration and provide low latency, synchronized sensor data pipelines for advanced robotics and industrial applications. The partnership leverages TI's mmWave radar and camera sensors with Lattice's low power FPGA technology to improve real-time AI sensor fusion.
Lattice Collaborates with TI to Develop Edge AI for Robotics and ...
Lattice Semiconductor and Texas Instruments (TI) are collaborating to enhance edge AI systems for robotics and industrial applications. The partnership combines Lattice's low-power FPGA platforms wit...h TI's embedded processors and analog technologies to enable real-time processing and sensor fusion. This collaboration aims to simplify development and improve power efficiency, targeting use cases like robotics and smart infrastructure.
Lattice, TI Collaborate on Real-Time Edge AI for Robotics
The collaboration between Lattice Semiconductor and Texas Instruments focuses on developing real-time edge AI systems for robotics and industrial applications. This partnership aims to simplify senso...r integration and enhance low-latency data processing by combining Texas Instruments' sensing technologies with Lattice's Holoscan Sensor Bridge solution. The joint effort targets improved system responsiveness and scalability in AI-driven environments, particularly for robotics and industrial automation.
Lattice and TI have formed a partnership to enhance edge AI capabilities for robotics. This collaboration aims to integrate Lattice's low-power FPGA technology with TI's advanced processors, optimizi...ng performance and efficiency in robotic applications.
TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World ...
The article discusses Texas Instruments' (TI) acquisition of Silicon Labs for $7.5 billion. This move aims to integrate Silicon Labs' wireless offerings with TI's manufacturing capabilities, enhancin...g TI's platform for industrial and automotive connectivity. The acquisition is expected to close in the first half of 2027, with significant cost synergies anticipated.